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EFEM(Equipment Front End Module)指在高潔凈環境下，將單片晶圓通過精密機械手傳輸至工藝、檢測模塊的晶圓前端傳輸系統。EFEM從屬于半導體生產設備，其中晶圓裝載系統（Loadport）、晶圓運輸機器人（Robot）、晶圓對準器（Aligner）是最核心的三大部件。
AEW6000系列EFEM主要完成對其他半導體設備的晶圓自動化傳輸。根據不同應用需求可搭載SEMI標準的FOUP、FOSB、OpenCasette、Smif Pod等裝載單元，亦可實現不同裝載單元的兼容配置。設備結構經過特殊設計并配備了微環境保持系統，可實現Class1的潔凈度要求。系統可選配雙面晶圓讀碼系統和晶圓翻轉功能，能夠穩定高效的完成各類晶圓的傳輸。
• 完全自主知識產權 • 標準化應用軟件 • SECS/GEM通訊 • 可處理薄晶圓
• 多種上料方式兼容 • 安全高效傳輸 • 深度客制化訂制
The AEW6000 Series EFEM is equipped primarily designed for automated wafer transfer to other semiconductor equipment. Depending on application requirements, it can be configured with SEMI-standard load ports such as FOUP, FOSB, Open Cassette, and SMIF Pod, and also supports compatibility configurations of different load ports. The equipment structure is specially designed and equipped with a micro-environment maintenance system, achieving Class 1 cleanliness standards. The system can be optionally equipped with a dual-side wafer ID reading system and wafer flipping function, ensuring stable and efficient performance in various wafer transfer scenarios.
• Fully proprietary intellectual property • Safe and efficient transfer • Deeply customized customization
• Compatible with multiple loading methods • SECS/GEM communication • Capable of processing thin wafers
地址：上海市浦東新區張楊路2389弄3號樓普洛斯大廈768室 電話：+86 13918352255 郵箱： xiwang@amsemi.com
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