Ø  適用于8”&6” wafer & 8” Frame;

For the 8 "& 6" wafer & 8" Frame;

Ø  手動上下料;

Manual loading and unloading;

Ø  自動裂片機構，可程序化控制；

Automatic crack mechanism, can be controlled;

Ø  攝像頭自動對正晶圓切割道，Theta角度馬達調整；

The camera automatically cuts the positive wafer cut, Theta angle motor adjustment;

Ø  程序可設定單向或雙向裂片動作；

The program can set a one-way or two-way crack action;

Ø  控制單元：基于PLC控制器，帶大尺寸觸摸屏；

Control unit: based on PLC controller, with large size touch screen;

Ø  晶圓良率： ≥99.9%；

Crystal yield: ≥ 99.9%;

Ø  UPH：>=6～8 PCS；

UPH:>=6~8 PCS;

Ø  更換產品時間：≤ 5 分鐘;

Replacement of product time: ≤ 5 minutes;

Ø  裂片質量：無崩角;

Riack quality: no collapse angle;